Single-crystal wafers and substrates
ATR Crystal supplies optical-grade crystal wafers and single-crystal substrates for photonics, electro-optic modulators, SAW devices, nonlinear optics and precision optical components. Available materials include lithium niobate wafers (LiNbO3), lithium tantalate wafers (LiTaO3), quartz single-crystal wafers and other drawing-defined substrates. Cut orientation, diameter, thickness, TTV, bow, warp, SSP or DSP polishing, surface roughness, edge criteria and inspection requirements can be reviewed according to the device process.
Selection guide
| Material | Typical role | Common applications |
|---|---|---|
| LiNbO3 wafer | Electro-optic, nonlinear-optical and piezoelectric single-crystal substrate. | Modulators, waveguides, PPLN research, SAW devices and photonics. |
| LiTaO3 wafer | Piezoelectric, pyroelectric and electro-optic substrate. | SAW filters, sensors, infrared devices and optical components. |
| Quartz single-crystal wafer | Stable piezoelectric and optical substrate with drawing-defined crystal orientation. | Frequency-control devices, SAW components, sensors and precision optics. |
Available products
Single crystal quartz wafers are synthetic quartz substrates used for SAW filters, resonators, frequency-control devices, optical low-pass filters, waveplates, polarizing optics, sensors, and precision…
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Lithium tantalate wafers, also known as LiTaO3 wafers, are single crystal substrates used for SAW devices, RF filters, pyroelectric infrared detectors, electro-optic components, nonlinear…
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Lithium niobate wafers, also known as LiNbO3 wafers, are optical and electro-optic substrates used when a device requires strong electro-optic response, useful nonlinear optical…
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Cut orientation, orientation tolerance, primary flat direction and drawing requirements can be reviewed before quotation.
Diameter, thickness, TTV, bow, warp, edge profile and handling requirements should be defined according to the downstream process.
SSP, DSP or lapped surfaces can be discussed with roughness, visual defect, particle and packing requirements.
Send material, size, quantity, surface treatment and application requirements. Drawings are recommended for custom geometries, arrays and assemblies.
FAQ
Please provide material grade, dopant, cut, diameter, thickness, TTV, bow, warp, polishing type, roughness, edge criteria, quantity and inspection requirements.
Optical-grade projects emphasize optical quality and surface finish, while SAW-grade wafers also require application-specific crystal orientation, flat direction and acoustic-device geometry.
Yes. Rotated cuts and drawing-defined orientations can be reviewed with orientation tolerance and reference-flat requirements.
