Optical Grade Lithium Tantalate Wafers
LiTaO3 Lithium Tantalate Wafers for SAW and Optical Applications
Optical grade lithium tantalate wafers, also written as LiTaO3 wafers or lithium tantalate single crystal substrates, are used in SAW devices, pyroelectric infrared detectors, electro-optic components, nonlinear optical devices, gyro sensors, and precision photonics substrates.
LiTaO3 offers stable mechanical and chemical properties, high optical damage threshold, and useful piezoelectric, pyroelectric, electro-optic, and nonlinear optical behavior. Wafer performance depends on cut orientation, diameter, thickness, polishing type, TTV, bow, warp, roughness, edge quality, and particle control.
ATR Crystal supplies LiTaO3 wafers in 2 inch, 3 inch, 4 inch, and 6 inch formats, with X-cut, Y-cut, Z-cut, and custom orientations available for engineering review. Fe, Zn, MgO, and other doped LiTaO3 wafers, boules, blanks, and customized optical components can also be discussed according to drawings and application requirements.
Applications of Lithium Tantalate Wafers
SAW devices, RF filters, and acoustic wave substrates
Pyroelectric infrared detectors and thermal sensing elements
Electro-optic modulators and photonic components
Quasi-phase-matching, SHG, OPO, and wavelength conversion projects
Gyro sensors, optical devices, and precision instrument substrates
Custom optical wafers, blanks, boules, and polished components
Advantages of LiTaO3 Wafers
- Piezoelectric and SAW performanceLiTaO3 is widely used as a substrate material for SAW and RF filter devices where cut angle, orientation tolerance, and surface quality are critical.
- Pyroelectric responseLithium tantalate is used in pyroelectric infrared detection and thermal sensing applications.
- Optical and nonlinear propertiesLiTaO3 can be used in electro-optic and nonlinear optical applications, including wavelength-conversion and photonics research.
- Stable crystal substrateThe material provides stable mechanical and chemical properties for precision wafer and optical component processing.
- Custom cut and polishingX-cut, Y-cut, Z-cut, custom orientations, SSP, DSP, low roughness, and wafer flatness requirements can be reviewed.
- Wafer-grade inspectionDiameter, thickness, TTV, bow, warp, flat length, edge condition, particles, scratches, and surface defects can be specified for quotation.
Available LiTaO3 Wafer Options
Common supply options for lithium tantalate wafers and crystal substrates.
| Item | Available Option | Design Notes |
|---|---|---|
| Diameter | 2 inch, 3 inch, 4 inch, 6 inch | Availability depends on orientation, thickness, grade, and quantity. |
| Orientation | X-cut, Y-cut, Z-cut, and custom cuts | SAW and optical applications may require specific cut angle and flat orientation. |
| Thickness | 0.18 mm and above; common values include 0.25 mm, 0.5 mm, and 1.0 mm | Thickness tolerance and TTV should be confirmed with wafer diameter. |
| Surface type | SSP or DSP | Single-side or double-side polishing should be selected according to device process. |
| Doped options | Fe, Zn, MgO doped LiTaO3 wafers | Doped materials should be confirmed by application, availability, and drawing. |
| Product form | Wafers, boules, blanks, customized optics | Custom shapes and optical components can be reviewed case by case. |
Product Parameters of Lithium Tantalate Wafers
The following values summarize typical LiTaO3 wafer parameters for engineering review. Final limits depend on wafer diameter, thickness, orientation, polishing type, and inspection standard.
| Parameter | Typical Value / Option |
|---|---|
| Material | LiTaO3 single crystal |
| Curie temperature | Approx. 603 +/- 2 C |
| Cutting angle | X, Y, Z, and custom cuts |
| Orientation tolerance | <= +/-15 arcmin, or tighter by review |
| Diameter | 2 inch, 3 inch, 4 inch, 6 inch |
| Diameter tolerance | <= +/-0.20 mm |
| Thickness | 0.18-0.5 mm or more; custom thickness available |
| Thickness tolerance | <= +/-0.025 mm, depending on wafer size and thickness |
| Primary flat length | 16 mm, 22 mm, 32 mm, or custom flat by wafer standard |
| TTV | Typically 1-5 um depending on wafer size, thickness, and grade |
| Bow | Typically within +/-25-40 um depending on wafer size and thickness |
| Warp | <= 35 um, depending on wafer size and grade |
| Orientation flat | According to ATR Crystal standard or customer drawing |
| Surface type | Single-side polished, SSP; double-side polished, DSP |
| Polished side Ra | <0.5 nm |
| Polished side surface quality | S/D 20/10 |
| Edge criteria | Compliant with SEMI M1.2 or IEC 62276 reference, depending on order requirement |
| Quality | Free of cracks; bubbles and inclusions to be controlled by agreed inspection criteria |
| Optical doping | Zn, MgO, Fe, or other options by review |
| Wafer surface contamination | None by agreed inspection condition |
| Particles | Particles larger than 0.3 um: <= 30, if specified in the order |
| Scratch and chipping | None by agreed inspection criteria |
| Defects | No edge cracks, scratches, saw marks, or stains by agreed inspection criteria |
| Packaging | Typically 25 pcs per wafer box, or custom packing on request |
LiTaO3 vs. Related Crystal Wafer Materials
LiTaO3 is often selected for SAW, pyroelectric, electro-optic, and nonlinear optical applications. Lithium niobate and quartz wafers may be preferred when the project requires different acoustic, optical, electro-optic, thermal, or cost characteristics.
| Material | Common Use | Main Advantage | Design Notes |
|---|---|---|---|
| LiTaO3 | SAW devices, pyroelectric sensors, optical and nonlinear components | Good piezoelectric, pyroelectric, electro-optic, and chemical stability characteristics | Cut angle, orientation tolerance, TTV, bow, warp, and surface roughness are critical. |
| LiNbO3 | Electro-optic modulators, photonics, nonlinear optics, SAW devices | Strong electro-optic and nonlinear optical properties | Often selected for integrated optics, modulation, and frequency-conversion work. |
| Quartz | SAW filters, resonators, optical windows, precision substrates | Excellent thermal stability, low loss, and mature wafer processing | Orientation such as ST-cut or 42.75 degree Y-X cut must be specified for SAW applications. |
| MgO:LiTaO3 | Optical and nonlinear applications | Doping can improve photorefractive-damage resistance in suitable applications | Doping level and process requirements should be confirmed before quotation. |
| Fe:LiTaO3 / Zn:LiTaO3 | Special optical and research applications | Dopant-dependent optical behavior | Availability and specifications should be reviewed case by case. |
How to Specify Lithium Tantalate Wafers
For LiTaO3 wafer orders, the most important specifications are material grade, cut orientation, orientation tolerance, diameter, thickness, thickness tolerance, TTV, bow, warp, surface type, roughness, edge criteria, primary flat, particle control, and packing method. For SAW devices, the exact cut angle and flat orientation are especially important. For optical and nonlinear applications, surface quality, optical doping, coating, and transmission requirements should also be confirmed.
If the wafer will be used in a production device process, provide the full drawing, wafer standard, surface inspection requirement, cassette or wafer-box requirement, and any SEMI or IEC reference. For prototype work, application details and target performance help choose a practical specification without unnecessary cost.
LiTaO3 Wafer RFQ Checklist
Providing the following information helps ATR Crystal review feasibility and quote more accurately.
| RFQ Item | Information to Provide |
|---|---|
| Application | SAW device, pyroelectric detector, electro-optic component, nonlinear optics, sensor, or custom substrate. |
| Material and doping | Undoped LiTaO3, MgO:LiTaO3, Fe:LiTaO3, Zn:LiTaO3, or other doped material requirement. |
| Orientation | X-cut, Y-cut, Z-cut, rotated cut, orientation tolerance, primary flat direction, and flat length. |
| Wafer geometry | Diameter, thickness, thickness tolerance, TTV, bow, warp, bevel, and edge criteria. |
| Surface requirement | SSP or DSP, Ra, scratch-dig, particle limit, contamination limit, and visual defect criteria. |
| Order information | Quantity, wafer box requirement, inspection report requirement, packaging, delivery schedule, and drawing. |
